MVP Inspection now represented by Rydon Technology Ltd
đź“° Rydon Technology Now Represents MVP Inspection Systems in the UK
Rydon Technology is proud to announce our new partnership with Machine Vision Products (MVP), a global leader in Automated Optical Inspection (AOI) and metrology solutions for microelectronics and semiconductor manufacturing.
As the official representative for the UK and Ireland, Rydon now offers MVP’s full portfolio of inspection platforms — designed to deliver precision, speed, and flexibility across wafer-level, packaging, and SMT production environments.
🔍 Advanced Inspection for Wirebond & Die Attach
MVP systems are engineered to detect critical defects in wirebonding, die attach, and epoxy placement — ensuring high reliability in hybrid electronics, RF modules, and semiconductor packaging.
Key capabilities include:
• 3D, telecentric, and microscopic optics for sub-micron surface and die inspection
• Automated defect detection for wirebond integrity, die placement, and epoxy coverage
• Flexible handling for wafers, film frames, JEDEC trays, leadframes, strips, and hybrid modules
• Defect marking options including ink, punch, laser, and wire removal tools
• Data integration via SECS-GEM, E142 Mapping, ELSR, and AutoData protocols
đź§ MVP Platforms Now Available Through Rydon Technology
Microelectronics & Hybrid Inspection
MVP 900 / MVP 900 DWMS / MVP 2030
• Ideal for wafer, wirebond, hybrid, and die attach inspection
• Supports magazines, trays, film frames, and manual or inline loading
• Offers real-time defect marking and full data traceability
Packaging & Metrology
MVP Aurora / MVP Aura
• Single and double-sided inspection for advanced packaging
• Measures coplanarity, lead integrity, and package markings
• Compact footprint with no limit on package size
SMT & SPI
MVP Versa / Versa Duo / Versa Pro
• AOI platforms for SMT and solder paste inspection
• Includes shadow-free 3D optics and legacy system compatibility
đź“© Interested in a demo or technical consultation?
Contact us at sales@rydontechnology.com
#MVPInspection #WirebondInspection #DieAttach #SemiconductorAOI #Microelectronics #AdvancedPackaging #Metrology #RydonTechnology #UKTech #YieldOptimization #AOI #SPI #




