Semiconductor Packaging Equipment-Molds, Trim and Form and Singulation Products


Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.

Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computing, automotive, industrial, LED and solar energy.

Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.