Photonic Wire Bonds – the benefits

No need for active alignment

Adaptable for any design due to software defined additive fabrication.

Compensates vertical and lateral alignment offsets by up to ± 20 µm.

Flexibility to support standard and non-standard waveguide pitch

Dense pitch down to 10 µm for high chip edge shoreline integration

Scaling from low-volume prototyping up to high-volume mass production

Facet-Attached Micro-Lenses- the benefits

No need for active alignment

Adaptable for any design due to software defined additive fabrication

Compensates vertical and lateral alignment offsets by up to ± 15 µm with 1dB penalty

Flexibility to support standard and non-standard waveguide pitch

Scaling from low-volume prototyping up to high-volume mass production