Cutting-edge assembly and testing machines serving requirements in R&D and all the way through to high-volume production.

ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are cutting-edge and are independent of the device material and of the specific application the device is targeting. Additionally, our modular system architecture is scalable from early device development environments, over new product introduction (NPI) and all the way up to high-volume requirements.

A globally installed base of over 1500 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more.

Assembly and testing remain the highest cost factors in photonic integrated circuit (PIC) production. To address this issue, international collaborations around the globe are actively researching new manufacturing concepts for PIC technology. The goal of these projects is to provide industry with an eco-system that will enable manufacturing to progress from the 1000s to the 100,000s and even millions, from single chip assembly to wafer-level approaches