Boschman specialises in the development and supply of advanced transfer molding and sintering systems for electronic assembly
Boschman Advanced Packaging Technology
Silver sintering is a die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. Resulting in high yield and high reliability.
Film Assisted Molding (FAM)
We research, design and prototype advanced packaging concepts. Together with you, we develop and assemble innovative, out of the box package solutions. It all starts with getting to know each other’s expectations, capabilities and limitations in order to build your tomorrow’s product today