Wire Bonding and Die Bonding Machines


Kaijo is a world leading manufacturer of High Speed  Wire Bonding and Die Bonding equipment for the Semiconductor and LED industry.

The FB-e18 is regarded as the highest speed wire bonder on the market with a speed of 0.043 sec/wire.

The DBX-1000 is a high speed Die Attach for Epoxy assembly with a speed of up to 14000 devices per hour