ficonTEC/Rydon Technology to present Wafer Level Test at POP3

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Rydon Technology will present the latest ficonTEC WLT findings at this years IMAPS POP3 event. The International event takes place on 18th October at the new Hi Tech and Digital Centre at the South Devon College.

I am really looking forward to presenting the latest developments of ficonTEC at the Conference as well as Exhibiting at the event. Please register for what promises to be the premier UK Photonics Packaging event of 2022.

POP3: The 3rd International Conference and Exhibition on Photonics and Opto Packaging – 17-18 October 2022

Boschman Advanced Packaging Technology now represented by Rydon Technology Ltd...Rydon Technology Ltd now adds Semiconductor Process Engineering and Technician...