📰 Rydon Technology Now Represents MVP Inspection Systems in the UK

Rydon Technology is proud to announce our new partnership with Machine Vision Products (MVP), a global leader in Automated Optical Inspection (AOI) and metrology solutions for microelectronics and semiconductor manufacturing.

As the official representative for the UK and Ireland, Rydon now offers MVP’s full portfolio of inspection platforms — designed to deliver precision, speed, and flexibility across wafer-level, packaging, and SMT production environments.

🔍 Advanced Inspection for Wirebond & Die Attach

MVP systems are engineered to detect critical defects in wirebonding, die attach, and epoxy placement — ensuring high reliability in hybrid electronics, RF modules, and semiconductor packaging.

Key capabilities include:

•  3D, telecentric, and microscopic optics for sub-micron surface and die inspection

•  Automated defect detection for wirebond integrity, die placement, and epoxy coverage

•  Flexible handling for wafers, film frames, JEDEC trays, leadframes, strips, and hybrid modules

•  Defect marking options including ink, punch, laser, and wire removal tools

•  Data integration via SECS-GEM, E142 Mapping, ELSR, and AutoData protocols

🧠 MVP Platforms Now Available Through Rydon Technology

Microelectronics & Hybrid Inspection

MVP 900 / MVP 900 DWMS / MVP 2030

•  Ideal for wafer, wirebond, hybrid, and die attach inspection

•  Supports magazines, trays, film frames, and manual or inline loading

•  Offers real-time defect marking and full data traceability

Packaging & Metrology

MVP Aurora / MVP Aura

•  Single and double-sided inspection for advanced packaging

•  Measures coplanarity, lead integrity, and package markings

•  Compact footprint with no limit on package size

SMT & SPI

MVP Versa / Versa Duo / Versa Pro

•  AOI platforms for SMT and solder paste inspection

•  Includes shadow-free 3D optics and legacy system compatibility

📩 Interested in a demo or technical consultation?

Contact us at sales@rydontechnology.com

#MVPInspection #WirebondInspection #DieAttach #SemiconductorAOI #Microelectronics #AdvancedPackaging #Metrology #RydonTechnology #UKTech #YieldOptimization #AOI #SPI #

Rydon Technology Now Represents Vanguard Automation in the UK & Ireland

Rydon Technology is proud to announce our new partnership with Vanguard Automation — a global leader in photonic packaging and integration. Rydon are now the official representative for Vanguard Automation in the UK and Ireland, bringing their cutting-edge 3D nano-printing solutions to photonics innovators across the region.

This collaboration marks a significant step forward in enabling next-generation optical device manufacturing, offering automated optical interconnect solutions that overcome design, performance, and scalability challenges.

Vanguard Automation: Revolutionising Photonic Integration

Vanguard Automation specialises in photonic wire bonding (PWB), a breakthrough technology that uses advanced 3D nano-printing to create single-mode freeform waveguides. These waveguides enable seamless integration between coarsely aligned optical components, ensuring highly efficient coupling even between waveguides with vastly different mode field profiles.

Their modular equipment platforms — Sonata and Reprise — are designed to deliver precision, scalability, and automation for photonic packaging.

The Sonata platform is Vanguard’s flagship solution for photonic wire bonding. It enables:

•  High-precision 3D nano-printing of freeform waveguides

•  Seamless optical interconnects between chips, fibers, and photonic components

•  Automated alignment and bonding with nanometer accuracy

•  Scalable production for R&D and industrial environments

Sonata empowers manufacturers to integrate photonic components with relaxed alignment tolerances, reducing complexity while boosting performance.

Reprise is a Fully automated post processing tool for development and encapsulation

What This Means for UK & Ireland Photonics

By partnering with Vanguard Automation, Rydon Technology now offers local access to world-class photonic packaging solutions. Whether you’re developing photonic integrated circuits, optical sensors, or quantum devices, Sonata and Reprise provide the tools to scale innovation from lab to fab.

We invite photonics researchers, engineers, and manufacturers to explore how Vanguard’s technology can transform your integration workflows.

Get in Touch

To learn more about Vanguard Automation equipment or request a meeting, contact our team:

Rydon Technology Ltd

📧 sales@rydontechnology.com

📞 +44 (0)1803 526939

📱 +44 (0)7801 966505

Let’s build the future of photonics — together.

Rydon Technology will present the latest ficonTEC WLT findings at this years IMAPS POP3 event. The International event takes place on 18th October at the new Hi Tech and Digital Centre at the South Devon College.

I am really looking forward to presenting the latest developments of ficonTEC at the Conference as well as Exhibiting at the event. Please register for what promises to be the premier UK Photonics Packaging event of 2022.

With the addition of our new partner Roartis, Rydon Technology Ltd is now able to work even closer with our customers. Roartis will custom formulate adhesives and resin solutions with specific performance requirements, even for low to medium volume applications. Our focus is to provide solutions for new and future market requirements.

The product portfolio includes:

• Electrically conductive adhesives,
• Insulating adhesives,
• Thermally conductive adhesives and potting materials,
• High temperature resistant adhesives,
• Underfills,
• Glob top and Dam & Fill resins
• Liquid resins for encapsulation and potting,
• Flame retardant materials, UL94-V0 certified,
• Optically clear adhesives, coatings and encapsulants
• UV-curable adhesives & inks.

If you product needs an Adhesive product please contact Rydon Technology we will arrange a discussion on how best to match your requirements.