Boschman Advanced Packaging Technology now represented by Rydon Technology Ltd in the UK and Ireland

Rydon Technology Ltd is pleased to announce that we are now the Representatives of Boschman Advanced Packaging Technology in the UK and Ireland.

“This is an exciting time for Semiconductor Packaging in the UK and Ireland. Boschman’s equipment offering is at the leading edge for Power Packages. Sintering is seen as the enabling technology for Power Packages. In addition Molding is being expanded into the Electronic Power Packaging where Overmolding is proving to hold many advantages. I am proud that Boschman choose Rydon Technology to represent them. Rydon has a depth of knowledge and track record of delivering on these exciting projects” -Mark Kenny-Managing Director-Rydon Technology Ltd.


Announcement local Boschman sales representation in the UK

Dear Customer,

Boschman Advanced Packaging Technology is pleased to announce that from 1st July 2022 Rydon Technology Ltd is assigned as the Sales Representative partner in the UK and Ireland market. This follows the retirement of John Watkins of Redcroft UK. Boschman would like to thank John Watkins for all his successful work in supporting the market development in the UK and helping in the smooth transfer of existing business to Rydon Technology Ltd.

Rydon Technology bring over 40 years of Advanced Packaging experience being actively involved in many Advanced Molding projects internationally. Rydon Technology Ltd was founded in 1986 specialising in the supply of equipment and materials for the Semiconductor, Photonics and Electronic Component manufacturing. Rydon Technology are recognised experts in the industry who have a clear passion to ensure success is achieved for its customers in the UK and Ireland.

“Boschman welcomes the opportunity to work closely with Rydon Technology at this exciting time in the development of the Semiconductor Packaging industry in the UK and Ireland. Boschman is a proven expert in Advanced Transfer Molding and Pressure Sintering. This is an exciting time for Power and Automotive Electronics and Wide Gap Semiconductors applications in the UK and Ireland. I believe Boschman and Rydon are the ideal partners to make your designs successful from package development to volume manufacturing”.

Rydon Technology Ltd will be introducing themselves to the existing UK and Ireland customers in the coming weeks and are committed to supporting your companies existing products and new developments. If you would like any additional information regarding Rydon Technology Ltd please see or contact Mark Kenny- Managing Director T: +44 7801966505 E: .

We look forward to continuing to develop and support your company and the industry in the UK and Ireland.

Sincerely yours,
Frank and Eef Boschman

Managing Directors
Boschman Advanced Packaging Technology