Rydon Technology will present the latest ficonTEC WLT findings at this years IMAPS POP3 event. The International event takes place on 18th October at the new Hi Tech and Digital Centre at the South Devon College.
I am really looking forward to presenting the latest developments of ficonTEC at the Conference as well as Exhibiting at the event. Please register for what promises to be the premier UK Photonics Packaging event of 2022.
Rydon Technology Ltd is pleased to announce that we are now the Representatives of Boschman Advanced Packaging Technology in the UK and Ireland.
“This is an exciting time for Semiconductor Packaging in the UK and Ireland. Boschman’s equipment offering is at the leading edge for Power Packages. Sintering is seen as the enabling technology for Power Packages. In addition Molding is being expanded into the Electronic Power Packaging where Overmolding is proving to hold many advantages. I am proud that Boschman choose Rydon Technology to represent them. Rydon has a depth of knowledge and track record of delivering on these exciting projects” -Mark Kenny-Managing Director-Rydon Technology Ltd.
Announcement local Boschman sales representation in the UK
Dear Customer,
Boschman Advanced Packaging Technology is pleased to announce that from 1st July 2022 Rydon Technology Ltd is assigned as the Sales Representative partner in the UK and Ireland market. This follows the retirement of John Watkins of Redcroft UK. Boschman would like to thank John Watkins for all his successful work in supporting the market development in the UK and helping in the smooth transfer of existing business to Rydon Technology Ltd.
Rydon Technology bring over 40 years of Advanced Packaging experience being actively involved in many Advanced Molding projects internationally. Rydon Technology Ltd was founded in 1986 specialising in the supply of equipment and materials for the Semiconductor, Photonics and Electronic Component manufacturing. Rydon Technology are recognised experts in the industry who have a clear passion to ensure success is achieved for its customers in the UK and Ireland.
“Boschman welcomes the opportunity to work closely with Rydon Technology at this exciting time in the development of the Semiconductor Packaging industry in the UK and Ireland. Boschman is a proven expert in Advanced Transfer Molding and Pressure Sintering. This is an exciting time for Power and Automotive Electronics and Wide Gap Semiconductors applications in the UK and Ireland. I believe Boschman and Rydon are the ideal partners to make your designs successful from package development to volume manufacturing”.
Rydon Technology Ltd will be introducing themselves to the existing UK and Ireland customers in the coming weeks and are committed to supporting your companies existing products and new developments. If you would like any additional information regarding Rydon Technology Ltd please see www.rydontechnology.com or contact Mark Kenny- Managing Director T: +44 7801966505 E: mark@rydontechnology.com .
We look forward to continuing to develop and support your company and the industry in the UK and Ireland.
Sincerely yours,
Frank and Eef Boschman
Managing Directors
Boschman Advanced Packaging Technology
With the addition of our new partner Roartis, Rydon Technology Ltd is now able to work even closer with our customers. Roartis will custom formulate adhesives and resin solutions with specific performance requirements, even for low to medium volume applications. Our focus is to provide solutions for new and future market requirements.
The product portfolio includes:
If you product needs an Adhesive product please contact Rydon Technology we will arrange a discussion on how best to match your requirements.
Rydon Technology Ltd is Proud to announce that TFA Europe’s technology is now part of our exciting Power Package capability in the UK. TFA Europe offer the most advanced Trim and Form solutions for the growing Power Electronics modules market. the single module technique is absolutely right for the industry at this time and will help advance this growing area of production.
TFA Europe appointed Rydon Technology as sole representative for the United Kingdom and Ireland.
In order to support the ever increasing demand of our unique Trimming & Forming solutions for Power Modules and our strive to be close to the customers we have appointed Rydon Technology as sole representative for the UK and Ireland.
With Rydon Technology we bring on board a wealth of experience in back-end assembly processes.
Rydon Technology Ltd was founded in 1986 specialising in the supply of equipment and materials for the semiconductor, photonics, electronic component manufacturing and SMT industries in Europe.
We look forward to further explore and expand our business in in the UK and Ireland in these exciting times.
Met vriendelijke groeten / with best regards / mit freundlichen Grüßen
Steven Derksen
Trim Form Automation Europe BV
In early April, Emil Otto GmbH presented the hand and surface sanitizers for the first time. Due to modified guidelines by the Federal Institute for Occupational Safety and Health (BAuA), these products can now be distributed. Ever since, the new product line has developed into a good revenue driver. Therefore, Emil Otto is expanding the product range and is now introducing more disinfectants for surface and hand cleaning.
The new sanitizers are either based on ethanol or ethanol-isopropyl alcohol. “The product development is based on different recommendations of the BAuA and the WHO. The BAuA recommends disinfectants to be based on isopropyl alcohol, whereas the WHO favours products based on ethanol or ethanol-isopropyl alcohol”, explains Markus Geßner, Marketing and Sales Manager of Emil Otto GmbH. Both product groups have a very good sanitizing effect. However, the WHO recommends products containing ethanol, as ethanol is much cheaper and is widely used internationally.
The disinfectants based on ethanol or ethanol-isopropyl alcohol are the hand disinfectants EO-HDC-002 and 003, respectively EO-HDC-004. Furthermore, the surface agent EO-EXO-CV2 is also based on ethanol. The disinfectant for surface cleaning EO-EXO-VC3 on the other hand is based on ethanol-isopropyl alcohol. “We can therefore offer our customers disinfectants that are not so dependent on the alcohol price on the world market and on supply possibilities. Since we do not know how the corona crisis will develop and whether further pandemic waves are to be expected, it is important to develop products that are free of price increases and speculation and will certainly remain available in large volumes,” said Geßner.
Like the disinfectants EO-HDC-001 and EO-EXO-CV, both based on isopropyl alcohol, which were first introduced, the new products will also be supplied to all public health institutions such as hospitals, doctors’ practices, health centres, but also to other care institutions and public supply facilities such as town halls, health authorities etc. at special conditions.
Rydon Technology Ltd announces 19th March 2019 that Leutz Lotsysteme is now available as part of our exciting portfolio.For the complete production of soldering masks, soldering frames and the entire product range! Leutz have developed and produced fast, flexible, affordable and efficient soldering systems for more than 30 years with the latest 3D CAD/CAM systems, a comprehensive selection or CNC machines and a very high quality standard. Certified in accordance with DIN EN ISO 9001:2008 and 14001.
The addition of Leutz now establishes Rydon Technology Ltd as the supplier of choice for theElectronics Maanufacturing industry in the UK and Ireland. Soldering pallets, Flux, stencils, cleaning products and Test solutions. We have quickly emerged as having a portfolio of Quality products for the Electronic Manufacturing industry.
Rydon Technology is proud to add Digitaltest to our exciting capability. Digitaltest offers World Class Test solutions from ICT to Flying Probe.
As a leading partner in the electronics industry, Digitaltest develops and produces automated test systems (ATE) for electronic circuit boards, software for automating production, and quality management systems.
Digitaltest is known for innovative solutions for optimizing the entire manufacturing process – as an interface between CAD, the testing process and production itself. We also offer comprehensive service and support, including complete outsourcing of PCB testing at locations worldwide.
For almost 40 years we have been offering technological leadership, reliability and intrinsic value in matters of automated test systems.
In addition to world class production software the Digitizer 2.0 Software solutions from Digitaltest allows the automated reconstruction of CAD data creating a unique set of capabilities for Electrical Test.
Contact sales@rydontechnology.com and let us work with you to obtain the right Test solution for you. Be it ICT or Flying Probe Condor.
QPL Limited are now certificated IATF16949 making them the perfect choice for Automotive Leadframes. In addition QPL have also introduced the HYBRID Plating options the top of the leadframe is Selective Ag plated and the bottom of the leadframe is either Full/Selective NiPdAu plated. Keeping at the forefront of Plating Technology
Rydon Technology proudly announces the addition of ficonTEC-Photonic Assembly and Test to our portfolio. Please contact sales@rydontechnology.com in the UK and Ireland and let us work to achieve the best solution for your production.
Photonics automated assembly and testing From Lab to Fab
Cutting-edge assembly and testing machines serving requirements in R&D through to high-volume production
ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are cutting-edge and are independent of the device material and of the specific application the device is targeting. Additionally, our modular system architecture is scalable from early device development environments, over new product introduction (NPI) and all the way up to high-volume requirements.
A globally installed base of over 600 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more.
Not resting with the status quo, ficonTEC is continually and actively involved in several internationally-supported initiatives. These initiatives promote access to integrated photonics technology through the transition to high-volume manufacturing processes via advanced automation, regardless of whether for singulated dies or for wafer-level approaches.
Rydon Technology is proud to announce the addition of the amfax a3Di to our growing portfolio. The amfax a3Di is a game changer in test. It uses metrology measurement to accurately measure in 3D your PCB board either bare, with Solder paste or fully attached. The system is not only great for measuring SMT boards and Solder paste it is also great when measuring Thru Hole devices, BGA’s and QFN Devices. It can also be used to inspect components prior to SMT placement. It is so powerful the amfax a3Di needs to be at the centre of your Test Strategy. It will be used not just to inspect but is so accurate it will be used as your process control tool. The a3Di will feedback results quickly so your production can react in real time. No other Test method gives this coverage so quickly and without the need for Test points. Please contact sales@rydontechnology.com for details and lets discuss how the amfax a3Di gives you a clear Test Strategy advantage.
Find more PCBA manufacturing faults in less time with a3Di
The a3Di is not a 3D AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCBAs like never before. The extremely accurate measurement capabilities of under a micron resolution in the Z axis will give you the confidence that if there is an issue on your PCBA, a3Di will find it.
When your 2D or 3D AOI system doesn’t deliver, a3Di will
Find manufacturing issues such as board warp, device co-planarity, foreign objects, pin height, solder joint and coating issues that affect the reliability of your product. a3Di will help lower the risk of field failures and expensive recall events that could negatively affect your brands reputation.
Kick false calls into touch!
a3Di does not use comparison techniques like traditional 2D and 3D AOI systems. It takes absolute metrology quality 3D measurements across the whole of the PCB assembly. No area is left unmeasured. These measurements are then referenced to the original CAD data meaning that if a fault is found it is a REAL fault. The result is that no subjective operator input is required as there are NO false calls or testing delays.
